Advanced Packaging Market Trends 2025

AI-Driven Growth, Heterogeneous Integration, 3D ICs, and U.S. Investments are Reshaping Semiconductor Innovation as of March 17, 2025, 8:46 AM CET.

Growth and Investment

According to Reuters (2025), ASE Technology Holding Co., the world's largest chip packaging and testing provider, projects its revenue from leading-edge advanced packaging and testing to more than double to $1.6 billion in 2025, up from $600 million in 2024. This substantial surge is attributed to the increasing global demand for AI chips, which require advanced packaging solutions to improve performance and energy efficiency.

To strengthen the semiconductor supply chain and foster domestic innovation, the U.S. Department of Commerce has announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging. This move underscores the strategic importance of the sector and the need to bolster U.S. capabilities in high-end chip manufacturing (Reuters, 2025).

Technological Advancements in Advanced Packaging

Nvidia, a dominant force in AI and high-performance computing, is actively reshaping advanced packaging technology. Jensen Huang, CEO of Nvidia, recently emphasized the company's evolving needs in semiconductor packaging. Nvidia's latest AI chip, Blackwell, employs the advanced Chip on Wafer on Substrate - Large (CoWoS-L) technology, marking a shift from the previously used CoWoS-S. This transition highlights Nvidia's strategy to increase its capacity for utilizing CoWoS-L packaging for newer chips, while continuing the production of Hopper, an older GPU architecture that still utilizes CoWoS-S (Reuters, 2025).

Emerging Trends in Advanced Packaging

Heterogeneous Integration | Semiconductor Design
The heterogeneous integration approach is transforming semiconductor manufacturing by integrating diverse components such as CPUs, GPUs, memory, and I/O dies into a single package. This method enhances performance and functionality while reducing power consumption, making it an essential advancement for AI-driven applications and high-performance computing (FormFactor, 2025).

3D Integrated Circuits (ICs) and Chiplet-Based Architectures: The Future of Packaging
The adoption of 3D Integrated Circuits (ICs) and chiplet-based architectures is gaining momentum. These technologies allow manufacturers to vertically stack dies or integrate modular chiplets, optimizing space, performance, and efficiency. This is particularly beneficial for data-intensive applications such as AI, cloud computing, and high-performance analytics (FormFactor, 2025).

The Rise of AI-Driven Semiconductor Demand
The explosion of AI workloads is pushing semiconductor firms to develop more advanced packaging solutions. AI models require high bandwidth memory (HBM), efficient interconnects, and multi-chiplet integration to manage computational loads effectively. Advanced packaging technologies such as CoWoS, fan-out wafer-level packaging (FOWLP), and embedded multi-die interconnect bridge (EMIB) are playing a crucial role in meeting these demands (FormFactor, 2025).

Market Implications and Future Outlook

The Advanced Packaging Market in 2025 is poised for strong growth, with technological advancements and strategic investments driving innovation. Companies like ASE Technology Holding Co. and Nvidia are leading the charge, while government initiatives, such as the $1.4 billion investment from the U.S. Department of Commerce, ensure continued development in this critical sector. With the increasing adoption of heterogeneous integration, 3D IC architectures, and chiplet-based designs, the semiconductor industry is entering a new era of efficiency and performance enhancement.

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This release was published on openPR.